Multi-Chip Module (MCM-D) Using Thin Film Technology

Authors

  • Cristina B. Adamo
  • Alexander Flacker
  • Wilson Freitas
  • Ricardo C. Teixeira
  • Michele O. da Silva
  • Antonio L. Rotondaro

DOI:

https://doi.org/10.29292/jics.v10i1.401

Keywords:

Multi-Chip module, passive components, benzocyclobutene, thin film multilayer

Abstract

Multi-chip Module (MCM) is a technology that can be applied to silicon and alumina modules allowing advantages in the integration complexity. This paper reports a MCM-D (D for deposition) technology suitable to fabricate passive components using two metal levels and non-photosensitive polymer benzocyclobutene as dielectric. The devices are produced using thin film technology, vacuum metallization, electroless and electrolytic deposition, photolithography process and wet etching. Electrical measurements and focused ion beam (FIB) were used to evaluate the characteristics of the MCM-D structures.

Additional Files

Published

2020-12-28