Millimeter-wave Wireless Integrated Systems: what to expect for future solutions

Authors

  • Ariana Lacorte Caniato Serrano University of São Paulo (USP) - Brazil
  • Gustavo Marcati University of São Paulo (USP) - Brazil
  • Igor Abe University of São Paulo (USP) - Brazil
  • Gustavo Palomino University of São Paulo (USP) - Brazil
  • Gustavo Rehder University of São Paulo (USP) - Brazil

DOI:

https://doi.org/10.29292/jics.v17i2.627

Keywords:

Millimeter-wave systems, Millimeter-wave devices, Interposer, 3D interconnection, CMOS technologies

Abstract

This paper intends to make a brief presentation of in integrated circuits’ developments and efforts towards new wireless applications at the millimeter-wave frequencies band. Considering low-cost applications for the consumer market, it is shown that using only one technology is not desirable for cost and size reasons. The 3D integration becomes a necessity for the new applications in such frequencies, pushing forward alternative technologies and new 3D interconnection techniques.

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Published

2022-09-17

Issue

Vol. 17 No. 2 (2022): Journal of Integrated Circuits and Systems

Section

Special Issue on Emerging Semiconductor Devices

License

Copyright (c) 2022 Journal of Integrated Circuits and Systems

Creative Commons License

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.