Millimeter-wave Wireless Integrated Systems: what to expect for future solutions

Authors

  • Ariana Lacorte Caniato Serrano University of São Paulo (USP) - Brazil
  • Gustavo Marcati University of São Paulo (USP) - Brazil
  • Igor Abe University of São Paulo (USP) - Brazil
  • Gustavo Palomino University of São Paulo (USP) - Brazil
  • Gustavo Rehder University of São Paulo (USP) - Brazil

Keywords:

Millimeter-wave systems, Millimeter-wave devices, Interposer, 3D interconnection, CMOS technologies

Abstract

This paper intends to make a brief presentation of in integrated circuits’ developments and efforts towards new wireless applications at the millimeter-wave frequencies band. Considering low-cost applications for the consumer market, it is shown that using only one technology is not desirable for cost and size reasons. The 3D integration becomes a necessity for the new applications in such frequencies, pushing forward alternative technologies and new 3D interconnection techniques.

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Published

2022-09-17

Issue

Section

Special Issue on Emerging Semiconductor Devices